Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Lead-Free Die Attach Reliability Assessment for High Temperature Environments|
|Keywords: Lead-Free, Reliability, Die Attachment|
|The increasing demand of electronic devices capable of operating at temperatures above the traditional 125°C is driving a major effort in research and development. Wide band semiconductors have been demonstrated to operate to temperatures up to 500°C, but packaging has been identified as a major hurdle for its development into functional products. Recent regulations, as RoHS and WEEE, are requiring the prohibition of toxic materials from electronic products; lead being a major concern due to its wide usage as a solder attach. In this investigation a series of novel Pb-free die attach technologies have been identified as suitable alternatives for high temperature applications, their fundamental metallurgy and manufacturing processes are described along with their fabrication sequence. The long term reliability is investigated through accelerated thermal cycling and physics-of –failure modeling, and its relative results are discussed through a round robin testing approach. Keywords: Lead-Free, Die Attachment, Reliability|
|Pedro Quintero, Graduate Research Assistant
University of Maryland