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Challenges in the Development of an Advanced Package using Fluidic Self Assembly
Keywords: via interconnect, fluidic self assembly, metalization
We encountered interconnection and metallization integrity issues during the development of a package for an RF device using fluidic self assembly process. The RF device, when powered using appropriate power resources, can receive an RF signal, store the required info, and respond according to stored information when prodded to do so through an RF signal. The package consists of a polymer substrate with self assembled device. A polymer coverlay layer protects and sandwiches the device between the substrate and itself. The interconnection to the outside terminals is provided using vias in coverlay polymer. Terminals on the coverlay surface make interconnect with the device through the vias in the coverlay over the terminals on the RF device embedded in the structure. Metallization is accomplished using photo process. In the course of this development, we also developed a method to attach the fluidic self assembled packages to the printed circuit board for electrical probing and testing. We used electrical testing, metallography and SEM observation to identify the causes of interconnection issues. In response to quality challenges, we redesigned the test board layout and the layout of traces on the package. We discuss the materials, processes and analysis techniques leading to the elimination of anomalies in prototyping of a package. Eventually the package was used successfully in an RF system. While we review the overall package design, we also analyze the limitation of the design, materials and processes and suggest alternates for environment specific applications.
Syed Sajid Ahmad, Manager of Engineering Services
NDSU Center for Nanoscale Science and Engineering
Fargo, ND

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