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Role of the Stacking BGA Balls on the Signal Integrity Performance of a Chip Scale Package Stack
Keywords: Stack, 3D Package, Signal Integrity
Demand for miniaturized electronic systems has led to the development of a number of 3D packaging technologies. Z technology from Tessera is a widely used technique for manufacturing 3D packages. In this method BGA solder balls are used to stack Chip Scale Packages. However these balls act as discontinuities in the controlled impedance signal paths of the package substrates potentially limiting high frequency performance of the stack. In this work we have performed full wave electromagnetic simulations using HFSS to understand the signal integrity issues arising from the stacking BGA balls in a 3D stacked package. Return loss and coupling has been computed over a frequency range for different ball sizes and inter-ball spacings.
Mohammed Shahriar Sabuktagin, Research Associate
University of Alaska Fairbanks
Fairbanks, AK
USA


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