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Design and Synthesis of Mesoporous Nano-Silver-Based Die Attach Material for High Power Electronics
Keywords: preparation, Ag nanorods, attach materials
With the breakthrough of the replacement of silicon by a wide band-gap semiconductor, such as SiC, GaN with high operational temperature and voltage in power semiconductor device, the design and synthesis of adhesive die attach materials ( applied to adhere the die to substrate) are also undergoing a revolution. Among of nanoparticles silver-based material is expected to be an excellent candidate due to its high thermal and electrical conductibility. In the work, we synthesize Ag particles with different aspect ratio and form a kind of new nano-Ag-based paste with and without nanoparticles. The mesoporous structure based on the Ag-paste is fabricated by various sintering process. The structure, thermal and electrical conductibility, and the joint strength of Ag layer are evaluated and discussed in detail in present work.
Katsuaki Suganuma, Professor
Osaka University
Osaka 567-0047, Japan

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic