Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Development of the Micro Heat Spreader for Eliminating Hot Spot in Electronic Packaging
Keywords: Thermal packaging, Heat spreading, Hot spot
The heat spreading technique in the chip level is a core technology for eliminating hot spots created by heat releasing in the various electronic devices and components. In this study, the Micro Heat Spreader(MHS) which could show high heat spreading efficiency by using latent heat transfer was developed and could be promising cooling device for eliminating hot spots. By this time, a heat spreader having a heat sink combined with a material of high thermal conductivity has been mainly used, however since the high packaging integration in the portable electronic devices is more and more increased, a need for cooling devices having superior heat dissipation capacity, small size and thin thickness is also increased. Presently the heat spreader pressed from the circular one has been used in the area of portable electronic devices having a smaller size than the laptop PC as a heat spreader or a heat transport device however that could meet a performance decreasing in the case of a packaging with thin thickness. This is due that the pressed heat spreader has no suitable structure for the thin thickness and has a deformed capillary structure by pressing. Since the micro heat spreader developed in this study has a thin thickness, a high heat dissipation capacity and flexibility in size, the results acquired from this study could become core technologies for securing a reliability of thermal control in the various electronic devices. The structure of the micro heat spreader with a middle plate having flow passages of the liquid and the vapor in addition to the upper and the lower plate was designed. Especially, the evaporator of the lower plate has two-stairs groove structure for preventing back-flow of bubbles and securing large vapor space. Through the experimental tests, the normal operating characteristics were confirmed and the thermal resistance according to the various input power has 1.27~1.71oC/W within the input power of 6W which is approached to the theoretical thermal resistance of 1.6oC/W.
Seok-Hwan Moon, Senior Member of Engineering Safft
Daejeon, 305-700,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems