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Design Considerations for Inkjet Printed Electronic Interconnections and Packaging
Keywords: Printed Electronics, System Integration, Interconnection
Printed electronics is an uprising technology for electronics integration and manufacturing. In addition to high-volume roll-to-roll processes, single sheet technologies can provide some fundamental improvements in system integration and conventional interconnection technologies, such as premanufactured interposer PCB and wirebonding. Utilization of the drop-on-demand inkjet printer in microelectronics packaging has been done at Tampere University of Technology. A chip scale package multilayer interconnections were constructed using inkjet printer combined with metallo-organic decomposition, replacing conventional wirebonding. [1, 2] Design considerations when using digital printing for electronic interconnections are somewhat different compared to conventional technologies. Traditionally, electronics have been designed using continuous vector graphics, and therefore transition to design based on bitmap graphics causes need for re-evaluation of design rules. Printing accurately fine conductive traces require proper jetting algorithm and device parameter optimization. General high-speed design rules are valid also when considering printed electronics, but those must be adapted to new technology demands. Novel device architectures have higher integration level, i.e. more functionality applied in the same structure. Moving towards process based manufacturing allows the designer to be more creative, but on the other hand, design has to be done in production’s terms. Forming of conductive traces is based on metal nanoparticle behavior, which allows sintering in low temperatures. However, temperatures must be applied longer periods of time compared to for example soldering, so material selection must be reconsidered. The research activities have related to inkjet technology capabilities for electronics integration. Design rules for drop-on-demand inkjet printing have been created during technology evaluation and results prove the trueness of conclusions done. More details of the results will be discussed. Reference [1] Pekkanen, V., Mäntysalo, M., Miettinen, J., Mansikkamäki, P. ”Novel Packaging Technology for Combo Memory Package” accepted to be published at proc. of 16th European Microelectronics and Packaging Conference & Exhibition in Oulu, Finland, June17-20, 2007 [2] Mäntysalo, M., Mansikkamäki, P., Miettinen, J., Kaija, K., Pienimaa, S., Rönkkä, R., Hashizume, K., Kamigori, A., Matsuba, Y., Oyama, K., Terada, N., Saito, H., Kuchiki, M., Tsubouchi, M. ”Evaluation of Inkjet Technology for Electronic Packaging and System Integration”, accepted to be published at 57th Electronic Components and Technology Conference (ECTC) in Reno, Nevada USA, May 29-June 1, 2007.
Mr. Ville Pekkanen, Researcher
Tampere University of Technology
Tampere FI-33720,

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