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Impact Property Evaluation of Ag-Epoxy Conductive Adhesive Joint
Keywords: conductive adhesive, impact, reliability
A conductive adhesive is one of the attractive alternatives to high-temperature solder. The joint reliability of Ag-epoxy conductive adhesive on shear and impact force was evaluated and was compared with that of Sn-3Ag-0.5Cu solder. A pendulum impact testing machine was proposed as the standard impact test method of conductive adhesive. Because of its robustness, the maximum load of conductive adhesive in impact test (795mm/s) increased by about twice that in shear test (5m/s). The absorbed energy of Sn-3Ag-0.5Cu solder in impact test is approximately eight times or more, larger than that of conductive adhesive. In contrast, the maximum load in shear test of conductive adhesive is larger (30% or more) than that of Sn-3Ag-0.5Cu solder. A lot of voids are generated in the joint according to the adhesive type, printing method and curing process. The effects of size and position of voids on the electric resistance, heat conductivity, shear strength and impact strength were also investigated. The effect of voids on joint strength is not significant when the total area of voids to joint area is less than 10%.
Do-Seop Kim, Researcher
Osaka University, Institute of Scientific and Industrial Research
Ibaraki, Osaka 567-0047,
Japan


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