Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|An Ultra High Performance 1Tbps Bandwidth Optoelectronic LSI Package using Post-Reflow Optical-Interface Stacking Technique|
|Keywords: LSI package, optical interconnection, optoelectronic package|
|We developed a compact size 1Tbps optoelectronic LSI package with the optical interconnection of 10.7Gbps x 96 lines (1027.2Gbps bandwidth) and the mounting area of 54mm x 54mm for a 12.5mm square LSI chip. A thin optical interface module (less than 1.7 mm thickness) was attached on an interposer, using a post-reflow optical-interface stacking technique (POST) that we had proposed*. To realize the thin optical interface, a small size hoop injection molded optoelectronic (OE) ferrule (4.4mm x 4.5mm x 1.0mm for 12 channels) was used for optical coupling. The LSI package has 8 OE ferrules (2 ferrules in each quarter area), and involves 96 (12 x 8) optical fibers in total. High speed signals do not pass through the printed wiring board (PWB), because high speed signals are pass through the optical fibers. The physical width of the optical interconnection with 256Gbps bandwidth is 6mm for each quarter area of the package. The POST LSI package is fully compatible with standard FR-4 PWB solder reflow process. This package includes a LSI interposer and said optical interface module, and the optical interface module is mechanically contact to the interposer after the reflow process. So this LSI package is cost-effective and has both high productivity and high reliability. In the evaluation of the LSI package, the eye diagram at 10.7Gbps was clearly open in each channel. *H.Hamasaki et al., ECTC2006, S7-3.|
Kawasaki-City, Kanagawa, 212-8583,