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Robust Wirebonding of Insulated Bonding Wire
Keywords: Wire bonding, Insulated Wire, Advanced Packaging
As the semiconductor industry continues to move towards high pin count, fine pitch, multi-row and multi-stack devices, wire bonding becomes an increasing challenge for todays semiconductor packaging processes. Insulated wire bonding technology has been identified on the 2006 ITRS Roadmap for Semiconductors as a viable, cost-effective solution to enable complex package designs, enhance package performance, and improve the yield of high-density packaging. In order to successfully implement insulated wire bonding, low cost integration into the existing packaging assembly infrastructure is of utmost importance. In particular, it is a requirement that the insulated wire demonstrate wirebonding performance which meets industry standard wire bond test specifications, when used on existing wirebonding assembly platforms. This paper will discuss various methods, techniques and processes that allow insulated wire to be bonded with high yield and reliability. Proper capillary selection and wire bonder setup, as well as correct use of bond parameters, loop parameters, and other advanced wirebond features will be highlighted.
Christopher Carr, Packaging Engineer
Microbonds Inc.

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