Micross

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New Developments in Wire Bonding for Future Packages
Keywords: Bonding wire, Reliability , Future development
Within the last years the bonding wire market is moving to ultra fine wires below 23m. World wide average diameter has moved from 27.6m in 2003 to 25.9m in 2006. Leading edge application are now using 18m in mass production. Driving forces are the decreasing package size and the trend to multifunctional, high integrated packages like SOP or SOC. Also cost reduction programs have a serious influence to wire diameter reduction. In terms of bonding wires the diameter must be reduced by keeping high tensile strength and good bondability. Also reliability must be ensured. Consequently the wire properties must be adjusted for all the new application. This paper will focus on the recent development of new bonding wire types for high reliability as well as for fine pad pitch (50-60 m) application. The positive influence of dopants to match material properties will be shown for different gold wire types of various grades from 99 to 99.99 % gold content. State of the art analytical investigation methods are used to determine high resolution cross sections of interconnections in order to obtain a better understanding of intermetallic phase growth phenomena. Results for typical tests like high temperature storage test, pressure cooker test will be shown. The technological barrier of bonding wires as well as future challenges will be discussed. This includes mechanical as well as materials points of view. An outlook for future potential emerging technologies e.g. room temperature bonding of gold wire, usage of Aluminum ribbons will be given.
Dr. Tobias Mueller, R&D Manager Bonding Wires
W. C. Heraeus GmbH, CMD-BW
Hanau, Hessia 63450,
Germany


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