Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Numerical Modeling WIAD in Dual-in-Line Laser Welding Package
Keywords: welding induced alignment distortion, numerical simulation, optoelectronic packaging
Semiconductor laser package bodies are mainly sorted into two types: the cylindrical-type and the box-type. When laser welding is used to assemble the package bodies, in general, it is necessary to adapt substrate, tube and clip and so on to handle and to retain the fiber within the package bodies. The purpose of using such optoelectronic elements is to enhance the package bodies. However, during the welding process, rapid solidification of the welded region and the associated material shrinkage cause a relative displacement between the welded parts. Such relative displacement inevitably results in welding-induced-alignment-distortion (WIAD) in the pre-aligned assembly. It will influence the reliability and stability of the welded packages. Therefore, it is necessary to gain a great insight of the welding induced alignment distortion by means of numerically investigation. At present, the knowledge of micro-scale joining such as optoeletronic application is limited. There are a lot of factors to influence the welding-induced-alignment-distortion of package bodies such as joint geometry, laser parameters, beam-to-beam energy balance, angle of laser incidence, mechanical properties of materials, and thermodynamic properties of materials in joint. In this paper, the finite element method is used to numerically analysis the effect of various factors on the WIAD of joint in order to find the way to minimize the WIAD, which will provide a guideline to obtain reliable and stable packages. Furthermore, the results obtained by numerical simulation of WIAD will provide solid base to the pre-compensation of alignment.
Wenning Liu, Researcher
Pacific Northwest National Lab.
Richland, WA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems