Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

High-Performance Broadband and High Frequency Interconnect Designs for RF Coaxial Connector to Multilayer Ceramic Package Transitions
Keywords: RF connector, ceramic package, broadband
The coaxial RF connector is commonly used as an interconnect transition between a coaxial cable and a transmission line internal to an electronic multilayer ceramic package. Military electronic and high-speed digital applications demand stringent and challenging electrical and mechanical design requirements for these interconnects. The transition between the coaxial cable and the connector is usually a coaxial-to-coaxial transition whereas the transition between the connector and the package will depend on the RF requirements, the orientation of the ceramic layers relative the connector axis of rotation, manufacturing design rules, and the transmission line type inside the ceramic package. This transition between the connector and transmission line presents a significant impedance mismatch that is usually compensated by a tuning microwave impedance matching circuit inside the multilayer package. In this paper, we survey the various available package connectors (GPPO, GPO, CPG, V, etc.) and launch configurations for RF applications. For band pass performance requirements of a few percent, several impedance matching methods and typical solutions are analyzed within the constraints of manufacturing design guidelines. We demonstrate that, given typical manufacturing rules for a package, only a connector with controlled impedance characteristics can provide broadband performance above 20 GHz, a typical frequency requirement for high-speed digital applications. We apply the controlled impedance design methodology to modify a GPPO brazed to a standard alumina package. Simulations and validation measurements for the modified GPPO (KGPPO) demonstrate broadband high-performance from DC to 30 GHz. Application of the broadband design methodology in addition to advanced design rules demonstrates simulated performance from DC to 40 GHz for the KGPPO.
Jerry Aguirre, Sr. R&NPD Engineer
Kyocera America Inc
San Diego, Ca
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems