Micross

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A Photoimageable Tape on Substrate System; Materials, Processing, & Reliability
Keywords: photoimageable, dielectric, multilayer
A new photoimageable dielectric tape on substrate system of materials and processing is discussed. The photoimageable tape is based on the Pb-free inorganic chemistry of Dupont QM44 dielectric thick film composition, and the system includes an array of compatible silver based conductors, Pb-free conductors, a via fill, heavy Aluminum wire bondable conductors, and other conventional thick film components including resistors. This “tape on substrate” approach takes advantage of a zero shrink process that provides dimensional stability, and the thermal benefits of the alumina base substrate. It enables one to easily obtain thickness uniformity of the dielectric layer and eliminates the need for multiple screen printing steps employed for dielectric printing. This substitution of a tape dielectric process for multiple screen printing and firing steps may provide a potential increase in manufacturing yield. The photoimageable capability permits the user to obtain resolution of fine features such as 75 to 150 micron diameter vias or larger cutouts, and the ability to place smaller vias close to one another to increase circuit density. The ability to increase circuit density by designing smaller features, and utilizing a multi-up concept, and the overall reduction in the number of processing steps help contribute to a manufacturing cost reduction. Finally, reliability of system components is discussed and demonstrated. Data presented includes soldered adhesion, thermal cycle adhesion of soldered and wire bonded materials, and laser trim stability of resistors.
Michael A. Skurski, Technical Service Representative
E.I. Dupont de nemours and Co., Inc.
Research Triangle Park, NC
USA


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