Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Experimental Investigation of Vapor Chamber|
|Keywords: Vapor chamber, boiling-condensation, thermal performance|
|The present article experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The influences of heating power, fill-ratio of working fluid, and size of heating area to the thermal performance are investigated. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1oC/W at 180W. A smaller heating area leads to a worse vapor chamber resistance. Besides, this study also compares the thermal performances of vapor chamber with those of an equal-sized copper plate. The results show that the heat transfer capability and heating spreading performance of the vapor chamber are all better than those of the copper plate.|
|Yuan-Chin Chiang , Assistant Professor
Department of Mechanical Engineering, Chinese Culture University