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Experimental Investigation of Vapor Chamber
Keywords: Vapor chamber, boiling-condensation, thermal performance
The present article experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The influences of heating power, fill-ratio of working fluid, and size of heating area to the thermal performance are investigated. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1oC/W at 180W. A smaller heating area leads to a worse vapor chamber resistance. Besides, this study also compares the thermal performances of vapor chamber with those of an equal-sized copper plate. The results show that the heat transfer capability and heating spreading performance of the vapor chamber are all better than those of the copper plate.
Yuan-Chin Chiang , Assistant Professor
Department of Mechanical Engineering, Chinese Culture University
Taipei 104,
Taiwan


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