Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Characterizing Package Supply Inductances for High-Speed Interface Systems|
|Keywords: supply noise, package inductance, package/PCB co-simulation|
|For high-speed I/O systems, power integrity becomes an important design parameter. As the data rates increase, the amount of distortion that can be tolerated in the system is decreasing, making the design of the power supply network increasingly challenging. A major parameter controlling supply noise is the inductance of the supply system in package and PCB, making the package supply inductance an important parameter for the package design. Specifying the package supply inductance for interface systems, however, can be difficult. The power distribution network is a combination of horizontal plane structures and vertical via structures with multiple input ports at the chip pads and multiple output ports at the component pins. The inductance seen by the chip inside the package is dependent on the current distribution inside the package, which again is determined by the supply environment this package will be operated in. In this paper we will define a methodology to specify the package inductance of high-speed I/O systems that captures the design intend of the supply system. We will show how a realistic current distribution in the package supply can be achieved using a co-simulation of the component package with a reference PCB environment. This reference environment is derived from the decoupling guidelines of the component. Next, we will show how the impact of the reference environment can be de-embedded from the results of this co-simulation, extracting the inductance contribution of the package alone. We will compare two de-embedding procedures and discuss the limitations of each of these approaches. Finally, we will present a measurement procedure used to verify the package supply implementation under realistic current distribution conditions, and correlations with inductance simulations used in the design process of this package.|
|Ralf Schmitt, Senior Engineering Manager
Los Altos, CA