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A Process Capability Study for the 01005 Stencil Printing Process
Keywords: 01005, Pb-free Solder, Process Capability
The advent of 01005 passive components has caused the electronics manufacturing industry to focus greater attention towards stencil printing research for miniature components. Most researchers have focused on the stencil printing process optimization through a series of well-planned Design Of Experiment (DOE) techniques that include materials, equipment and process parameters. Results from these studies clearly indicate that the stencil printing process for 01005 passives is highly dependent on stencil thickness and solder paste type. The effect of various aperture shapes and sizes, however, has been shown to be somewhat ambiguous. One reason for this ambiguity is the lack of detailed statistical analysis that could bring out the subtle effect of these factors. One such statistical method to consider is the use of process capability indices (PCIs). A process capability index (Cp, Cpk, and others), is the ratio of the tolerance of some characteristic feature in a product to the variability of the process that creates the product. In a printing study, the product is essentially a solder deposit and the process is that of stencil printing (including aforementioned factors such as stencil thickness, paste type, printer variables, etc.). This paper attempts to add to the knowledge base of 01005 deposits by further analyzing the data from an 01005 stencil printing experiment conducted by Nambiar et al. (2007) via the use of PCIs. The solder paste used in this experimentation is SAC305.
Krishnan Vishwanathan, Graduate Student
Binghamton University
Johnson City, NY
USA


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