Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Integrated EMI Shield for RF Modules: Packaging Technology, Simulation and Characterization
Keywords: EMI, RF Module, Packaging
For next generation highly-integrated MCM packaging for RF modules and analog circuits, electromagnetic interference (EMI) issues are expected to be critical to RF performance. RF modules require higher levels of miniaturization that place more demands on the package layout, component placement, and constraints on the shield placed above the components within the module. With continued reduction on module size, electromagnetic interference between the various sections of the same module, and between closely spaced modules can severely impact the overall module RF performance. In this work, integrated shielding technologies are investigated and evaluated in order to eliminate or mitigate the effect of electromagnetic interference (EMI) within the same module and from the module to the outside. New packaging technologies and assembly processes are developed to implement the integrated shield in RF Modules. Electromagnetic numerical modeling is used to predict the effects of different shielding solutions and a series of experiments are conducted to verify the simulation results and determine the shield effectiveness in EMI isolations.
Thomas Noll, Packaging Staff Engineer
Skyworks Solutions
Irvine, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems