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Development of an M3-Approach for Optimal Electromagnetic Reliability in System Packages
Keywords: M3-approach, system packages, electromagnetic reliability
Due to the myriad of advantages offered by system packages (e.g., SiP) over conventional packaging technologies, they have emerged as leading technologies for the development of high-performance and cost-effective compact microelectronic products, especially for RF/high-speed applications. To reach the miniaturization goals of these products, integrated components in system packages are placed quite closed to each other, and more geometrical discontinuities (e.g., bends, vias ) are used to facilitate horizontal and vertical routing, thereby resulting in an increase in geometrical complexity. Such complexity, coupled with the steady increase in operating frequencies, so as to meet the demands for more bandwidth, makes it challenging to efficiently design system packages without causing electromagnetic reliability (EMR) problems (e.g., signal/power integrity and EMC/EMI problems) which may lead to system malfunctioning or even failure. To prevent such occurrences, design measures which take into consideration EMR problems within the frequency range of interest must be used. In this paper, a novel approach, the M3-approach (Methodologies-> Models-> Measures), we developed and used to extract such design measures will be presented and illustrated. Using this approach, novel methodologies for accurate and efficient modeling of SiP modules under consideration of EMR effects were first developed. Test samples were fabricated and the extracted models were experimentally validated. These models were then used to study the impact of package components and their interaction on system performance at RF/microwave frequencies. Based on the extracted results, optimal design measures were derived. For example, to minimize reflections and distortions, measures that enable an optimal choice and configuration, as well as the maximum allowable number of discontinuities along signal paths were developed. Implementing these preventive measures at the pre-layout stage leads to the elimination of re-design efforts and place/route iterations. Consequently, time to market as well as cost is considerably reduced, while performance is optimized.
Ivan Ndip, Group Manager of RF & High-Speed System Design
Fraunhofer IZM
Berlin 13355,
Germany


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