Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

High Performance Liquid Metal Thermal Interface for Large Volume Production Use
Keywords: Thermal interface, Chip cooling, Liquid metal
Thermal Interface Materials (TIMs) between microprocessors and heat-sinks are crucial for cooling high performance components at todays power levels. The Holy Grail of TIMs for high power processors has been a thin metallic layer that can withstand the thermal expansion mismatch between silicon chips and copper based caps or heat-sinks. This work focuses on a Liquid Metal Thermal Interface (LMTI) developed for high volume production in computer systems. Compared to the best polymer thermal interface, LMTI boosts the interface conductivity by an order of magnitude. It also minimizes issues of mechanical compliance and load. The paper examines reliability requirements in deploying LMTI that include providing good wetting of the liquid and protection from oxidation and corrosion. It also presents examples of temperature gains obtained with LMTI in actual products, as well as a demonstration of cooling capability in excess of 750 W/cm2 obtained in conjunction with a water cooled heat-sink.
Yves C. Martin, Research Staff Member
IBM - T.J. Watson Research Center
Yorktown Heights, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic