Micross

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LTCC Design Techniques for Microwave Integrated Circuits used in Radar and T/R Modules
Keywords: Microwave Integrated Designs, LTCC, T/R and Radar
Phased array radar and Transmit/Receive (T/R) Module applications demand a low cost, highly functional, reliable and repeatable materials system for integrating the ICs and microwave circuits for Microwave Integrated Circuits (MICs). Low loss LTCC (Low Temperature Co-Fired Ceramic) materials are well positioned as a module and packaging solution due to its long history of use in military radar applications, as well as, use in high volume commercial applications such as cellular, Bluetooth and WLAN FEMs. This presentation will discuss the use of DuPont Green Tape LTCC for phased array radar and T/R modules. Specifically, we will review a.) Broadband transitions from the ICs to Microwave Circuits, b.) techniques for improving signal performance between RF channels on Microwave Circuits, and c.) optimization methods for interconnect with ICs, microwave and millimeter wave circuits and antennas.
Tim Mobley, Design and Applications Development Eng
DuPont Electronic Technologies
RTP, NC
USA


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