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Abstract Preview
Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
| LTCC Design Techniques for Microwave Integrated Circuits used in Radar and T/R Modules |
| Keywords: Microwave Integrated Designs, LTCC, T/R and Radar |
| Phased array radar and Transmit/Receive (T/R) Module applications demand a low cost, highly functional, reliable and repeatable materials system for integrating the ICˇ¦s and microwave circuits for Microwave Integrated Circuits (MICˇ¦s). Low loss LTCC (Low Temperature Co-Fired Ceramic) materials are well positioned as a module and packaging solution due to its long history of use in military radar applications, as well as, use in high volume commercial applications such as cellular, Bluetooth and WLAN FEMˇ¦s.
This presentation will discuss the use of DuPont„§ Green Tape„§ LTCC for phased array radar and T/R modules. Specifically, we will review a.) Broadband transitions from the ICˇ¦s to Microwave Circuits, b.) techniques for improving signal performance between RF channels on Microwave Circuits, and c.) optimization methods for interconnect with ICˇ¦s, microwave and millimeter wave circuits and antennas. |
Tim Mobley, Design and Applications Development Eng
DuPont Electronic Technologies
RTP, NC
USA |
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