Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Package Design for a High Brightness LED|
|Keywords: LED, Packaging, High-brightness|
|High-brightness LEDs produce heat that could damage the device if it is not properly cooled. This paper presents a new package design that improves heat dissipation for a high-brightness LED. The heat dissipation is accomplished by all-metal interfaces from the anode of the LED to the heat sink. The LED is soldered to a copper subassembly, which is then soldered to a copper heat sink. Since no epoxies or ceramics are used to bond the LED, thermal resistance is minimized. A thin-film interface was developed to provide a platform for the LED cathode and the 22-gauge copper wire. To make this interface, paramagnetic Ni/V is sputtered on Si, then Au is sputtered on the Ni/V. Initial testing results show that the package design allows for LED operation at an input power of 6.5 Watts for 24 hours without failure.|
|Brian Wright, Graduate Student
California Polytechnic State University
San Luis Obispo, CA