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Packaging and Processing of a State-of-the-Art Encryption Technology
Keywords: Encryption, FIPS 140-2 Level 4, physical security
In today’s world the “bad guys” are becoming ever so much more sophisticated in their ability to attack, conquer and plunder their victims. So much so that the victims may be totally unaware that any event untoward has taken place. Where in the past the attack may have happened with physical weapons of war and siege, today it can occur with a computer and an internet connection. This can occur at a personal level with home computers where they can be hacked into and personal information taken. This is even more true of large computer systems performing mission critical operations. We have all heard where computers have been compromised and personal credit card information has been stolen or hospital records taken. Many computer applications exist where it is not acceptable for the data or transmission of data to be compromised. One solution would be to completely isolate the computer application. But often the application cannot perform its function in total isolation. Several examples come to mind where this is true: Banking, large multi-location businesses, internet based sales, airlines, just to name a few. In order to prevent such attacks from being successful, IBM, SEM and Gore have collaborated on a state-of-the-art physical security package to protect the hardware components of a cryptographic coprocessor module. This package meets the highest level of physical security requirements contained in the United States Government - Federal Information Processing Standard, FIPS, 140-2, Security Requirements for Cryptographic Modules- level 4, and supports the overall attainment of FIPS 140-2 level 4 for the cryptographic coprocessor. The packaging technology includes tamper response if any attempt is made to gain access to the module. This paper will give an overview of the packaging protection features of the package and the manufacturing processes used to assemble the package.
Phillip Isaacs, ECAT Technology and Procurement Engineering
IBM, Gore and SEM
Rochester, MN
USA


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