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Zero Shrinkage LTCC Tape for Integral Substrate / Package
Keywords: ISP (Integral Substrate / Package), Zero Shrinkage, BGA, High Sealed Package
To meet the demand of multi-IC die assembly and multi-I/O terminal in MCM-C, This paper introduce the designing, manufacturing, and inspection of a kind of Integral Substrate / Package with BGA terminal which made from Heraeus zero shrinkage system by LTCC process. And formed large cavity ceramic package that co-fire by multi-layer substrate and multi-layer wall, and it is a high sealed package that can do parallel-sealing.
Charles Luo, Professor
Heraeus Materials Technology Shanghai Ltd.
Zhuanqiao Town, Minhang District, Shanghai 201108,
P. R. China

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