Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Status Quo and Development of China Semiconductor Packaging Industry|
|Keywords: Packaging, Semiconductor, China|
|Abstract to come|
|Keyun Bi, Professor, President of CEPS
China Academy of Electronics and Information Technology