IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Micro Mechanical Behaviors of Sn, SnPb and Alloys during IN-SITU Tensile Test under SEM and TEM
Keywords: Sn, SnPb , Alloys , SEM and TEM
Abstract to come.
Dr. Chunqing Wang , Professor
Harbin Institute of Technology
150001 Harbin,
P. R. China


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001