Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low Strength Green Moulding Compound for Lead Frame Packaging Application|
|Keywords: Lead Frame , Packaging , China|
|Abstract to come.|
|Dr. Jianglong Han , General Manager
Henkel Huawei Electronics Co., Ltd.
P. R. China