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Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Automotive Semiconductor Sensor and Packaging Technology
Keywords: Semiconductor , Packaging , Automotive
Abstract to come.
Takahiko Yoshida, Senior Manager
Denso Corporation
Aichi-ken 448-8661,
Japan


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