Here is the abstract you requested from the Passives_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Performance Improvements Through the Use of Embedded Capacitors in Flip-Chip IC Packages|
|Keywords: Embedded Passives, Flip-Chip Substrate IC packges , Planar Laminate capacitors|
|The integration of embedded Thick Film capacitors and polyimide based planar capacitor laminate materials in IC packages has been investigated by a joint program sponsored by DuPont with the Georgia Institute of Technology Packaging Research Center (PRC). The PRC provided fabrication, electrical modeling and simulation and DuPont provided the component materials. Test vehicles with different designs were fabricated and tested. The test vehicles included embedded ceramic-fired-on-foil Thick Film capacitors with microvia interconnects and structures with planar capacitor laminate layers. Build-up dielectric layers were interconnected by semi-additive processing and laser microvia technology. Measured electrical performance data were used to create models of alternative package designs and to perform simulations to determine the designs offering the most effective power delivery and noise decoupling in accordance with substrate feature needs projected by the ITRS roadmap. The presentation will include integration of capacitors into substrate layers in close proximity to the IC, capacitor interconnections designed for low inductance and low impedance and achieving low target impedance over a mid-frequency range through capacitor designs and arrays resulting in a range of different resonance frequencies.|
|Daniel Amey, Research Fellow