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Embedding Technologies for Active and Passive Components
Keywords: Embedded Chips, Lamination, MMiC
Technologies for the embedding of active components into build up layers of printed wiring boards have increasingly attracted attention over the recent years. Due to different requirements with respect to electrical performance, chip dimensions, and bond pad metallization a couple of different embedding technologies have been developed. Some of those technologies are now employed in large scale production. In this paper we will give an overview of embedding concepts ranging from MMiC embedding, to thin embedded active chips into conventional build up layers to the embedding of ultra thin discrete passive components. For MMiC embedding the chip conditioning, the interconnection scheme and the definition of the peripheral system will be discussed. The use of advanced material suited for high frequency electrical signal processing is mandatory. Performance and processing results of these materials will be shown. The embedding of active chips can be realized with different technologies using a flip chip approach followed by embedding or either a die bond process followed by lamination and microvia formation. The choice of technology is driven by factors such as chip dimension, pad configuration/metallization and cost/yield. An interesting application is the embedding of integrated passive devices. Finally the embedding of discrete passive components is an emerging option since discrete component manufacturers offer ultra thin versions of the products specially aimed for embedding. For each embedding concept besides the results obtained on laboratory scale also the process chain requirements and risks will be discussed. Embedding of latter is an emerging technology supported by discrete component manufacturers.
Thomas Loeher, Project Manager Development
Technische Universität Berlin
Berlin 13355,

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