Here is the abstract you requested from the Passives_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Embedded Thin-Film NiP Resistor Technology for PWB's Recent Developments in Lead-Free and Microwave Applications|
|Keywords: embedded thin film resistors, lead-free compatibility, combined embedded resistor/capacitor cores|
|The use of thin-film NiP resistive alloy materials in printed circuit boards has been extensively documented over 30 years with excellent reliability and performance characteristics. Recent requirements in advanced printed circuit board designs for the use of lead-free materials and low loss dielectrics has resulted in the evaluation and incorporation of new dielectric materials and copper foils to meet these new criteria. This paper examines some of these new requirements, the materials selected to meet them, and the test results of the modified copper/resistor/dielectric materials. Further, advances in copper foil topography and thin dielectric materials has allowed the development of a recently patented NiP thin-film resistor/distributed capacitance core material for replacement of separate embedded resistor, embedded capacitor cores in printed circuit boards. The properties and characteristics of the combined material are detailed.|
|Bruce Mahler, Vice President
Ohmega Technologies, Inc.
Culver City, CA