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Microstrip Thin-Film MCM-D Technology as Enabling Platform for the Integration of High-Performance SiP Modules
Keywords: Integrated Passive Devices, System in a Package, Though-substrate vias
The thin-film multi-chip module technology (MCM-D) on AF45 Glass has been shown in the past to be a viable technology for the integration of Systems in a Package (SiP) on a CPW configuration. However, todays need for 3D high-density packaging requires the use of micromachining techniques which are limited by the use of AF45 glass. Therefore, a thin-film MCM-D technology on 100um thick High-Resistivity Silicon (HRSi) is being developed to allow the use of micromachining techniques. The use of HRSi also increases the amount of power that the technology can handle because it has a higher thermal conductivity than glass. This paper presents the integration of through-substrate vias on 100um thick high-resistivity silicon wafers within the MCM-D technology. The vias have a diameter of 100um allowing the use of microstrip type of components and circuits at a broad range of frequencies. High-quality integrated lumped elements such as thin-film resistors, capacitors and inductors are demonstrated on a microstrip configuration within the MCM-D technology making use of the vias. A 1nH microstrip inductor presents a quality factor of about 50 between 6 and 7GHz. Microstrip lines integrated on the thin HRSi present a quality factor 2.5 times higher than CPW lines with similar dimensions on AF45 glass, highlighting the advantages of using microstrip type of circuits. Low loss distributed-element band-pass filters centered at 30 and 60GHz are presented proving the ability of the technology to integrate high quality circuits at different frequencies. Being able to integrate high quality passive components at various frequencies, the MCM-D technology on HRSi is a powerful technology platform for the integration of high performance SiP modules.
Guillermo Posada Quijano, Student
Leuven B-3001,

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