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Low Temperature Sintering of Printed Nano-Particulate Materials for Fabrication of Passive Electronics
Keywords: Photonic Curing, Nano-particulate, Sintering
Several technologies are used for post processing printed material during fabrication of passive electronics. This paper will focus on how Photonic Curing. a technique developed by NovaCentrix, Austin, Texas, compares to other sintering techniques. Photonic Curing is being developed to cure or sinter metal nano-particle based films by exposing them to a brief, intense pulse of light from a xenon flash lamp. This photonic curing technology allows for rapid and selective heating that fuses nano-scale metallic ink particles into functional components. This technology allows the curing or sintering of nanoscale metallic ink patterns on low-temperature substrates including flexible circuit boards, flat panel displays, interconnects, RFID tags, and other disposable electronics without the use of heat. This paper reports on the results obtained after sintering conductive, magnetic, and dielectric nano-particle inks. Sintering was performed with the photonic curing technique developed by NovaCentrix, 2W frequency doubled Nd:YAG CW laser, and a conventional muffle furnace. Sample thickness, micro-structural details, resistivity, and sintering characteristics are also examined and compared for the sintering techniques.
James W. Sears, Director - Additive Manufacturing
South Dakota School of Mines & Technology
Rapid City, SD
USA


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