Here is the abstract you requested from the Passives_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Integrated Passives: Trends in IC Packages|
|Keywords: Passives, IC Packages, Substrates|
|In this presentation, integrated passives providing an alternative to issues associated with discrete parts, including the cost, handling, assembly time, yield, and space associated with discrete components will be discussed. Trends in each of the areas will be described including advantages/disadvantages as well as drivers for adoption.|
|E. Jan Vardaman , President, Senior Analyst
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