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Integrated Passives: Trends in IC Packages
Keywords: Passives, IC Packages, Substrates
In this presentation, integrated passives providing an alternative to issues associated with discrete parts, including the cost, handling, assembly time, yield, and space associated with discrete components will be discussed. Trends in each of the areas will be described including advantages/disadvantages as well as drivers for adoption.
E. Jan Vardaman , President, Senior Analyst
TechSearch International, Inc.
Austin, TX
USA


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