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A Survey of Organic Materials for Printed Circuit Board Based Cavity Packaging
Keywords: liquid crystal polymer (LCP), packaging, electronic packaging
Compact high performance opto-electronic, radio frequency (RF) and micro-system components and modules with high reliability can be manufactured by using liquid crystal polymer (LCP) printed circuit board (PCB) based packaging and interconnects. This LCP PCB based platform provides the component or module designer with design flexibility, easy integration of multiple functionalities, excellent electrical performance and a more efficient design cycle. This LCP PCB based packaging approach consists of a multi-layer LCP PCB onto which chips are mounted and interconnected via the PCB. The LCP PCB substrate, by virtue of its excellent electrical properties, facilitates additional functionality such as impedance matching or other passive RF functions. The cavity package is completed with a lid that can be an injection molded part, facilitating complex 3-dimensional input/output (IO) functionality such as optical or fluid IO for opto-electronic and micro-system applications respectively. While this approach provides a route to highly integrated and high performance components and modules, a common concern with organic packaging is reliability, particularly with respect to moisture ingress, as compared to metal and ceramic packaging. By analyzing theoretically and empirically the LCP PCB based platform, we have demonstrated functionally hermetic performance with respect to moisture ingress - LCP PCB based test vehicles maintain internal moisture content well below the MIL-STD-883-1018 allowed 5000ppm level after exposure to 1000 hours of 85oC / 85% relative humidity. Consequently, by employing these design approaches, LCP PCB based packaging can be used for high reliability applications, thus taking advantage of the cost, design and performance benefits of this packaging platform.
Linas Jauniskis, Senior Engineer
Foster Miller Inc.
Waltham, MA

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