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Thermal Management of High Heat Density Semiconductor Devices
Keywords: thermal management , diamond , junction temperature
Emerging microelectronic components including high speed processors, wide bandgap Radio Frequency and power conversion devices, and opto-electronic devices, exhibit exceptionally high heat densities requiring innovative techniques for their thermal management. For many of the systems in which these components are deployed, due to reliability, size, weight, cost, and overhead power considerations, its is preferable that such thermal management approaches be convective ambient air based. A practical packaging solution for effective heat removal from high heat density components is presented. The approach, employing a combination of pyrolytic graphite sheet and diamond pins embedded within an expansion matched metal matrix composite, efficiently extracts the heat from the devices, spreads it to a large area, and transfers it to the air coolant media. Modeling indicates that the approach provides for significant reductions in device junction temperatures with corresponding increases in performance and reliability. Sample packages for transmit/receive modules, which populate the active array antennas of modern radar systems, have been fabricated and characterized verifying the analytical models.
Robert Hay , Vice President - Sales
sp3 Diamond Technologies, Inc.
Dudley, MA

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