Here is the abstract you requested from the MASH_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Lead-Free Electronics: A Reliability Update|
|Keywords: Lead-free, Reliability, RoHS|
|Available lead-free materials and their associated reliability are changing rapidly as the search for “drop-in” replacements for tin-lead solders and termination finishes. There are a number of studies looking at the basic mechanisms of tin whisker growth, whisker mitigation methodologies, and tin plague. The DOD and industry groups have or are developing standards for the use of lead free materials in server service long life high reliability applications. This paper will summarize the current situation and what can be expected in the near future.|
|Andrew D. Kostic, Ph. D., Fellow Engineer
Northrop Grumman Corporation