Micross

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Multi Chip Modules (MCM), Miniaturization meets Reliability and Optimum Performance
Keywords: Reliability, Miniaturization, Performance
MCM’s are often referred to as hybrids or chip & Wire technology - which enables customers to reduce their board size, increase reliability and optimize circuit performance. Increased reliability A robust and reliable product is produced by using tried and proven assembly processes including: film on ceramic substrates; die attach; wire bond; and seam sealing processes. Military screening may also be performed to further qualify the product. Miniaturization Discrete, passive, and active components are all used in unpackaged die form allowing for increased component count in a much smaller footprint. Optimum performance The components are squeezed into a tighter area thus reducing the electrical interconnects (wires and trace lengths). This greatly reduces stray capacitances and inductances allowing optimum performance of both the individual components and the entire system. The module can also be actively trimmed to ensure that the system is fully calibrated and optimized prior to delivery. Cost effectiveness You may think that the MCM is produced at an increased price, but one MCM replaces multiple discrete, passive and active components offering several areas of cost saving, including: • Just one component to procure (as opposed to hundreds) • lot-to-lot variability is eliminated (system is fully tested and trimmed) • the assembly process is simplified • a more reliable product. • shortened time-to-market of the final product In conclusion MCMs simplify circuit design allowing the design engineer to spend more time on improving the performance of the end product.
Robert Costa, Sales And Marketing Manager--Hybrid
C&D Technologies
Mansfield, MA
USA


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