Micross

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Wafer-Level Hermetic Packaging for MEMS Devices
Keywords: MEMS, Packaging, Wafer-Scale
This paper presents a reliable, modular MEMS package based on a novel micromachined seal technology. A key advantage of this process is that it forms metal-to-metal seals and eliminates the need for organics (ie. adhesives). These packages have demonstrated compatibility with a range of unusual types of MEMS, including SOI, piezo, and RF devices. The bonding process also provides microbumps for low-loss integration with CMOS. These packaged have undergone standard reliability tests, including helium-leak, high-g shock, thermal cycling and thermal shock, and demonstrated yields of approximately 100%.
Wallace Tang,
MicroAssembly Technologies
Richmond, CA
USA


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