Here is the abstract you requested from the MASH_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wafer-Level Hermetic Packaging for MEMS Devices|
|Keywords: MEMS, Packaging, Wafer-Scale|
|This paper presents a reliable, modular MEMS package based on a novel micromachined seal technology. A key advantage of this process is that it forms metal-to-metal seals and eliminates the need for organics (ie. adhesives). These packages have demonstrated compatibility with a range of unusual types of MEMS, including SOI, piezo, and RF devices. The bonding process also provides microbumps for low-loss integration with CMOS. These packaged have undergone standard reliability tests, including helium-leak, high-g shock, thermal cycling and thermal shock, and demonstrated yields of approximately 100%.|