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Utilizing Vacuum Soldering, in a Flux Free Environment, to Reduce Voids in Microwave Packaging Assemblies
Keywords: Vacuum soldering, Void free attach, Flux free environment
The widespread use of microwave systems has placed an important focus on optimizing the assembly and manufacturing process. The materials and techniques developed to assemble these packages must assure that quality and reliability of the device performance is taken into consideration. For a package to survive and perform flawlessly in a hostile environment, the selection of materials and the solder joining method will help control and prevent voiding in reflow soldering. Improved advancements were developed where flux less and void less results were achieved utilizing vacuum and positive gas pressure, known as a pressure variation method, to reduce the final void volume. The principle of the pressure variation method is to use a vacuum to lower the partial pressure of oxygen, which sufficiently prevents oxidation, and to use an external inert gas pressure to compress any trapped voids in the solder joints that are present during the molten stage of the solder reflow. The ability to control the process parameters and to control the soldering environment,without flux, will help establish a void free bond which contributes to the reliability and high performance requirement of the microwave device.
Paul W. Barnes, Vice President of Sales
SST International
Downey, CA

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