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Summary Report for Implementing Solder Mask Pillars to Standoff Leadless Components
Keywords: Pillars, Solder Mask, Leadless Components
This Summary Report details the results of an internal research and development effort to build and evaluate leadless components soldered to printed wire assemblies (PWAs). This effort was performed to determine the actual solder thickness under component pads using established manufacturing procedures. Two different printed wire board (PWB) configurations were used, four contained solder pillars to “stand off” parts from the board by .005 in nominally to help achieve a specified thickness of solder, as well as four others that had their pillars removed as a control group. Within each of these sets, half utilized standard Sn63 leaded solder and the other half utilized lead-free solder. The solder thickness was substantially thicker on the boards with solder pillars for 2 out of the 3 components in question. There was an average increase of .001675 in of solder on these two components. This made their average overall solder thickness approximately .00425 in. The result of this effort supports commonly used techniques in reliability analysis of leadless packages for extreme environments.
Ms. Martha Veselka, Manager- Severe Environment Packaging
L-3 Communications - Communication Systems East
Camden, NJ
USA


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