Abstract Preview

Here is the abstract you requested from the MASH_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Leveraging Wafer-Level Packaging and Miniaturized System Integration for Military Applications
Keywords: Wafer-level packaging, System-level integration, Advanced stacked packaging
In the field, soldiers depend on accurate, reliable and secure data transmission, often requiring devices that can be transported easily in a range of environments. What if you had a mobile device that could record, store and transmit audio, visual and location information all on a device the size of an iPod nano? This would enable previously unfeasible applications, ranging from detailed battle field assessment, friend or foe determination to multimodal human activity monitoring in intelligence applications. By leveraging its expertise in advanced stacked packaging, high-density ball-grid array (BGA) packaging, and complex system integration and miniaturization, Tessera was able to turn this idea into a reality. For example, Tessera used die stacking technology to bundle the microcontroller and non-volatile flash memory die onto a smaller footprint than had been achievable with traditional adjacent placement. Interconnections are established through wire bonds to a BT substrate, which also carries the metallic interconnections between the die. Tessera’s system miniaturization expertise enables integration of this complex design on a single and small-scale PCB. This paper will discuss the real-world development of a first-generation, lead-free prototype device that features battery and storage capabilities supporting up to 48 hours of operation before recharging is required, GPS location updates at 15-second intervals, phone-quality voice recording and VGA-resolution digital imaging. In the paper, Tessera will address several challenges that were encountered and successfully addressed during the design process by applying advanced wafer-level packaging technologies and antenna placements. For example, the integration of two separate antennas, a GPS and RF link, required innovative layout and placement to minimize interference between them. Furthermore, intelligent power management was required to maximize battery lifetime without encountering thermal issues.
Naghmeh Sarkeshik, Senior Manger, Programs
Tessera Inc.
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems