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|Optimization & Comparison of Techniques for the Heat Sink Selection using Operations Research Methods|
|Keywords: Optimization, Heat Sink selection, Operations research methods|
|The increase in electronics packaging density and considerable reduction in system volume for higher functionality and compactness, there is an increase in heat involved in the system drastically. This heat disrupts the performance of the system, especially the sensitive components like chips present in the board or system. Hence, it is mandatory to identify a faster and economical cooling solution. Reliability and life period of electronic equipment can be increased by minimizing the component temperature of the equipment and the system. . Heat sinks are devices that enhance heat dissipation from a hot surface, usually the case of a heat generating component. Cooling effect can be increased by decreasing the resistance of the heat sink. This can be done by varying the design parameters of heat sink. A Genetic Algorithm (GA) based approach is followed for the optimization of effectiveness in cooling and reduction in mass of the heat sink. An experimental setup has been made with an electric heater as source and temperatures at various nodes in the heat sink are recorded. Analytical solutions have been obtained by designing a heat sink calculator and validating it by linear programming (LP) formulations. The optimization function is to maximize the cooling effect. The design variables considered for optimization are number of fins, thickness of the fin length and height of the heat sink. The preliminary constraints are mass and aspect ratio. By running the program, the optimal parameters were obtained. The simulation is performed using the heat sink optimizer software. The results of experimental setup are compared with GA, LP and heat sink optimizer. The above comparison will facilitate the selection of heat sink with least mass and highest cooling efficiency for prolonging the life of the sensitive electronic devices and subsequent reduction in package volume.|
|S. Manivannan, Asst. Professor
Raja Rajeswari Engineering College
Chennai, Tamil Nadu 600012 ,