Abstract Preview

Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Innovative Thermal Design for High Power LED Applications
Keywords: Heatsink, Thermal Management, Assembly
CeramTec AG’s Electronic Applications Division presents a new application in high-performance ceramic: The ceramic heat sink for applications with highest power density. CeramTec provides automotive-industry approved combinations of ceramic substrates and metallisations for electronic applications. Now it is possible to use the newly developed heat sink like a substrate. Solder or bond heat sources like LED`s or dies directly on the heat sink. Place passive and active components directly on the ceramic heat sink and reflow this assembly. This new ceramic solution reduces complexity and the number of different materials for optimal thermal management of high power applications while at the same time increasing system reliability, especially in hotspot applications. Heat sinks with circuits are available for air and liquid cooling. Material characteristics of the ceramic heat sink are electrical insulation, high volume resistivity, thermal cycling stability, high breakthrough voltage, no corrosion and also no water intrusion. Ceramic materials like Rubalit® and Alunit® are fully ROHS compliant.
Dr. Claus Peter Kluge, Manager Business Development
CeramTec AG
Marktredwitz D-95615,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems