Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Phase Change Metallic Alloy TIM2 Performance and Reliability|
|Keywords: PCMA, Thermal Interface Material, Reliability|
|With processor power levels exceeding 200 Watts and nearly 25% of the overall processor junction-to-ambient thermal resistance budget consumed at the second-level thermal interface (TIM2), the use of an all-metal interfacial thermal path is highly desirable. Phase Change Metallic Alloys (PCMAs) offer superior thermal performance due to their high thermal conductivities and low contact resistance, resulting from excellent surface wetting. Also, reworkability and ease of handling make this attractive in a high volume setting. The current work utilizes an In-situ Test Vehicle (ITV) comprised of a simulated processor package and motherboard, coupled to a heat exchanger. Comparative thermal performance of a PCMA and organic thermal interface products (in-situ TTV measurements) will be presented. Additional reliability data from PCMA samples subject to various environmental stress conditions (unavailable for presentation at ASME InterPACK ’07) shall be discussed.|
|Chris G. Macris, CTO
North Bend, WA