Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Silicone Thermal Interface Materials: High-Performance Heat Dissipation Solutions|
|Keywords: silicone, interface, thermal|
|One of the key issues facing engineers designing next generation systems for computing and wireless/telecom is the management of heat. Managing heat dissipation impacts the performance, reliability, and longevity of the very electronic devices they are trying to advance. The thermal management challenges today and tomorrow are stagering due to increasing component density, smaller component footprint, greater functionality, and greater power consumption. The unique properties of silicone as formulated in various thermal interface material technologies can help achieve higher levels of physical and electrical performance in electronics. Furthermore, silicone can withstand harsh environments other chemistries can not. And, now, silicone is dissipating heat in a variety of forms allowing the end user the flexibility of choosing and handleing wet or pre-fabricated materials with a variety of properties in a multitude of offerings: gels, adhesives, encapsulants, gap fillers, fabricated pads, and phase-change materials.|
|Jason D. Clark, Application Engineer & Technical Service Professional
Dow Corning Corporation