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High Temperature and High Heat Flux Cooling for Electronics
Keywords: heat pipes, phase change cooling, high heat flux cooling
Advanced Cooling Technologies, Inc. has been developing four new cooling technologies with applications in electronics cooling. These technologies are: 1. High temperature water heat pipes. Titanium/water and Monel/water heat pipes have been developed and life tested at temperatures up to 280 C, much higher than conventional copper/water heat pipes (150 C). The titanium heat pipes can also reduce the heat pipe mass. 2. High temperature Loop Heat Pipes (LHPs). These titanium/water LHPs extend the operating temperature range for LHPs from the current 60 C to 200 C. 3. Cold Plates with Oscillating Flow. Heat spreaders can reduce the heat flux to be removed from electronics, making it easier to remove heat without exceeding the maximum allowable temperatures for electronics. ACT is developing a cold plate that uses the oscillating flow of a single phase fluid to spread the heat. Preliminary results show effective thermal conductivities of up to 240,000 W/m K (versus 1,200 W/m K for diamond and 90,000 W/m K for heat pipes), and the ability to remove heat fluxes as large as 1,200 W/cm2. 4. Hybrid pumped/wick system with multiple evaporators. In a hybrid pumped/wick system, water flows through an artery in contact with a wick. Water evaporates from the wick, cooling the electronics. Capillary forces pull replacement water into the wick. The use of a pump allows multiple evaporators to be used. Very high heat fluxes can be removed at very low thermal resistances (as low as 0.16 C/W/cm2).
William G. Anderson, Principal Engineer
Advanced Cooling Technologies, Inc.
Lancaster, PA
USA


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