Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Practical Application Guidelines for Vapor Chambers for Electronics Thermal Management
Keywords: Vapor Chamber, Guidelines, Applications
Vapor chambers have been designed, proposed, and evaluated for use as heat spreading devices for high-performance server processors for twelve years. Actual use of vapor chambers in volume applications has been limited, whether as a stand-alone device or as the baseplate for a finned heat sink. There are several reasons for the slow market acceptance of this thermal solution concept. This presentation will provide design and application guidelines to assist the practicing thermal engineer in recognizing where vapor chambers of various types can be effectively utilized. Topics will include: Practical designs for current vapor chambers When is a heat pipe a vapor chamber? Current development progress for extremely thin and bent forms of vapor chambers Wick structures and impact on final product performance Flatness of vapor chamber structures and practical limits for design Physical size and length of heat transport as guidelines to proper and practical application of vapor chambers Performance data for flat vapor chambers as heat spreading bases for heat sink assemblies, versus all-copper bases Examples of current production assembly designs utilizing vapor chambers Performance data for examples Relative cost examples. feasible embedded components; Identifying needs for future development to enhance vapor chamber utilization as heat spreaders in commercial electronic systems. Key areas of developing market segments which are considering and selecting vapor chamber thermal solutions include server processors and high performance ASICs; power LED modules; and commodity processor heat sink solutions.
George A. Meyer IV, Vice President and Development Director
Celsia Technologies LLC
San Jose, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems