Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Performance Test Validation Tool Design for Debugging Engineer in Chip-Maker Industry|
|Keywords: validation, tool, chip|
|As more power is exhausted on a chip, the temperature control of a chip for de-bugging engineers in chip-maker industry becomes a hard task in thermal management. A high performance test validation tool should handle up to 200 Watts/cm2 in the range of -50oC to 150oC for a chip or a processor. The tool also should have performances of fast temperature response, scalable size, remote control, low noise, flexible choice for cooling sources (chiller, house water, or without chiller) and highly reliable. The test validation tool is a system comprising of cooling source, thermal head, and temperature controller. We used structures which combines dimple, pin-fin, micro-channel and micro-jet to develop and design heat dissipation device in the mini-scale level, which not only guarantee high performance of the heat dissipation device but also scale device’s size from 8 mm to 10 cm. A smart temperature control system, which can identify temperature control parameters for different thermal heads, was developed to achieve requirements which include fast temperature response, remote control and low electric noise. By introducing self-contained cooling modules or a manifold w/o chiller, the test validation tool is flexible with cooling source selection.|
|Michael Spokoiny, CTO
United States Technology Consortium