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Liquid Cooling Viability for Mainstream Microelectronics Thermal Management
Keywords: liquid cooling, market driver, mainstream microelectronics
Questions are still being raised about liquid cooling and its viability for mainstream microelectronics thermal management. Considering all of the recent advances in chip technology and air cooled heat pipe-heat sink assemblies, these questions include the following: (1) Are there real thermal management barriers for the development of next generation products that cannot be overcome with air cooled heat sinks? (2) What are the advantages of liquid cooling? (3) What are the characteristics that make a liquid cooling system viable for the mainstream market? (4) What is the current and future market size for liquid cooling? Aiming to answer these questions, this presentation discusses the technical and market drivers for liquid cooling adoption. This presentation further argues the case that liquid cooling is now a viable mainstream solution by exploring the key characteristics of a state-of-the-art liquid cooling solution.
Monem Alyaser, PhD, Vice President of Business Development
Asetek USA
Menlo Park, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic