Here is the abstract you requested from the Thermal_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Rheo-Mechanical Properties of Thermally Conductive Materials|
|Keywords: Thermal, Materials, Rheo-Mechanical|
|Abstract to come.|
|Sanjay Misra , Sr. Scientist and Technology Group Manager
The Bergquist Company